Silicon chip warpage: confocal profilometry

Confocal Laser Scanning Profilometry of silicon chip
Description:
Silicon chip processing relies on accurate positioning of connections not only in both X and Y planes – but also in the Z domain, to give consistent quality and positive registration. Confiocal Laser Scanning Microscopy produces a large area 3D image with high vertical axis resolution. The 43 x 43 mm image shows a peak to valley flatness of 85 microns.
Industry Sectors:
Semiconductor, Photonics/Optoelectronics
Techniques:
Confocal Laser Scanning Profilometry
Keywords:
flatness measurement, failure analysis