Services

Failure Analysis

Our specialist team uses a comprehensive range of analysis and characterisation techniques to identify causes of failure. Combining macro, micro and nanoscale microscopy, spectroscopy, characterisation and materials testing techniques, we determine cause of failure saving companies time and money. 

Core Capabilities

 Key Techniques
  • Defect identification and location
  • Contaminant mapping and characterisation
  • Structural analysis
  • Chemical and elemental analysis
  • Stress measurement and mapping 
  • Mechanical and biomechanical testing
  • Thermal
  • Electrical failure
  • Solder joint and electrical contact failure
  • Corrosion, degradation, oxidation
  • Interface characterisation
  • Coatings and thin films characterisation
  • Optical Properties

Our partners, National Physical Laboratory, QinetiQ, Taylor Hobson, BAE Systems have a proven track record in successful identification of the causes of failure in materials and devices.

Contact us to discuss your challenges 

Failure Analysis Application Snapshots

Silicon wafer bonding: wafer warp
Wafer contamination detection
Fuel Injector Leakage
Clutch Component
Multilayer Interface Dislocation
Wafer Crystal Defects
Oxygen Contamination