Failure Analysis

Our specialist team uses a comprehensive range of analysis and characterisation techniques to identify causes of failure. Combining macro, micro and nanoscale microscopy, spectroscopy, characterisation and materials testing techniques, we determine cause of failure saving companies time and money.

Core Capabilities	Key Techniques
Defect identification and location Contaminant mapping and characterisation Structural analysis Chemical and elemental analysis Stress measurement and mapping Mechanical and biomechanical testing Thermal Electrical failure Solder joint and electrical contact failure Corrosion, degradation, oxidation Interface characterisation Coatings and thin films characterisation Optical Properties	Electron Microscopy (SEM, TEM) Energy Dispersive X-ray Analysis (EDX) Electron Backscatter Diffraction (EBSD) Infra-red Spectroscopy (FTIR) Raman Microscopy X-ray Diffraction and Topography Dual beam deflection stress measurment Stylus and Optical profilometry Micro and NanoIndentation Vickers Hardness Testing Calorimetry Thermal Imaging 4 Point Probe Spectrophotometry

Our partners, National Physical Laboratory, QinetiQ, Taylor Hobson, BAE Systems have a proven track record in successful identification of the causes of failure in materials and devices.

Contact us to discuss your challenges

Failure Analysis Application Snapshots

Silicon wafer bonding: wafer warp
Wafer contamination detection
Fuel Injector Leakage
Clutch Component
Multilayer Interface Dislocation
Wafer Crystal Defects
Oxygen Contamination

CEMMNT Services