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Metrology is critical at each stage of product manufacture. Pure wafers need to be characterised for roughness, bow, crystallinity and sub-surface defects. Subsequent deposition, etching, masking and micromachining processes all require metrology to measure not just the critical dimensions of structures but a range of materials properties from stress through to electrical, thermal and mechanical characteristics.
CEMMNT partners QinetiQ, Taylor Hobson and National Physical Laboratory are ideally positioned to comprehensively address all metrology requirements, combining state of the art equipment in clean-rooms with proven rapid response problem solving expertise.

Crystal growth of AlGaN on GaN, AFM
Wafer roughness and bow
Wafer lattice parameters, strain, and crystallinity
Film thickness and stress
Layer composition
Depth profiling
Defect, contaminant and dopant detection
Critical dimension measurement
Chemical and elemental mapping
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Optical Profilometry
Stylus Profilometry
Scanning Electron Microscopy
Atomic Force Microscopy
Stress Measurement
Secondary Ion Mass Spectrometry
X-ray Diffractometry
X-ray Topography
X-ray Reflectometry
X-ray Photoelectron Spectroscopy
FTIR Spectroscopy
Micro-Raman Spectroscopy
Ellipsometry
Colour coded elemental distribution on semiconductor device, TEM with EELS