MicroSystems/MEMS


Metrology is crucial for not just MEMS innovation but in identifying defects at early process stages to minimise wastage costs. Our partners provide world-class design, measurement and characterisation expertise for MEMS, MicroSystems and MicroFluidics. From providing open access to CoventorWare design and simulation tools to clean room metrology and characterisation, we can add value at each stage of the device life-cycle.

Our metrology solutions range from initial wafer level analysis to a range of approaches for dynamic characterisation of packaged and unpackaged final devices. Thin films, passivation layers and contaminants can all be characterised. Our expertise extends to analysis of key structural mechanical, thermal and electrical properties.

 





MicroSystems/MEMS
PZT pressure sensor, optical profilometry

Core Design, Measurement and Characterisation Capabilities

Design and Simulation
Systems Engineering
Critical Dimensions
Film thickness
Stress
Elemental Composition
Defect and dopant detection
Modulus
Resonant frequencies
In and out of plane motion
Resistivity
                                                       

Key Techniques

CoventorWare design and simulation tools
Systems Engineering
Vibrometry
Dynamic MEMS Profilometry
Optical Interferometry
Stylus Profilometry
Scanning Electron Microscopy (SEM)
Atomic Force Microscopy (AFM)
Stress Measurement
Secondary  Ion Mass Spectrometry (SIMS)
X-ray Diffractometry (XRD)
X-ray Topography (XRT)
X-ray Photoelectron Spectroscopy (XPS)
Ellipsometry
                                                                                                                                                                                                                                       Relay, SEM

Application Notes