Metrology is critical for characterising both device performance and in failure analysis. 3-D critical dimensions determination is becoming increasing critical in the drive to further minaturisation.

Commonly applied techniques include non contact optical and confocal profilometry which can non-destructively map PCB’s, determining feature volumes, track widths etc.

Infra-red and Raman chemical mapping techniques can identify chemical composition of materials causing failure such as organic residues, solder leakage and corrosion.  Thermal imaging and stress determination are also key tools for identifying causes of failure.